30μm / 50μm Single-Sided and Double-Sided Polyimide PI + FEP Composite Film with High Temperature Resistance, Strong Bonding Strength, for Copper Foil Lamination and Electronic Insulation

PI + FEP composite film is a high-performance laminated material made of polyimide (PI) film coated with fluorinated ethylene propylene (FEP) on one side or both sides. It combines the excellent heat resistance, dielectric insulation, mechanical strength, and flexibility of PI with the strong bonding performance and low dielectric characteristics of FEP.

This material is widely used in applications requiring high temperature resistance, reliable lamination, electrical insulation, and stable bonding performance, such as copper foil lamination, flexible printed circuits, high-frequency electronic materials, and composite insulation structures.

Our PI + FEP film is available in both single-sided and double-sided coated constructions, with standard thickness options including 30μm PI + 10μm FEP, 30μm PI + 10μm + 10μm FEP, 50μm PI + 10μm FEP, and 50μm PI + 10μm + 10μm FEP.

Key Features

• Excellent high temperature resistance

• Good adhesion to copper foil and other substrates

• Good dielectric insulation performance

• Low dielectric properties for high-frequency applications

• Flexible structure with good dimensional stability

• Available in single-sided and double-sided coated types

• Suitable for lamination, bonding, and insulation applications

• Custom width and roll length available upon request
   

  Standard Specifications

  Structure Type	PI Thickness	FEP Thickness	Total Structure
  Single-sided coated	30μm	10μm	30μm PI + 10μm FEP
  Double-sided coated	30μm	10μm + 10μm	30μm PI + 10μm + 10μm FEP
  Single-sided coated	50μm	10μm	50μm PI + 10μm FEP
  Double-sided coated	50μm	10μm + 10μm	50μm PI + 10μm + 10μm FEP

   

  Material

  Base Film: Polyimide (PI)

  Coating Material: FEP
   

  Customization

  Custom width

  Custom roll length

  Custom thickness structure subject to evaluation

  Roll form

  Sheet form available on request

  Supply Form

  Structure Options

  Single-sided FEP coated

  Double-sided FEP coated
   

  Typical Applications

   

  Copper foil lamination

  Flexible printed circuit boards (FPC)

  High-frequency and high-speed electronic materials

  Electrical insulation layers

  Heat-resistant composite structures

  Electronic bonding and lamination applications

  Insulation materials for demanding thermal environments
   

  FAQ

  Q1: What is PI + FEP composite film?

  A: PI + FEP composite film is a laminated material made of polyimide film coated with FEP resin on one side or both sides. It combines the thermal and mechanical strength of PI with the bonding and insulation advantages of FEP.

  Q2: What are the standard thickness options?

  A: Our standard structures include 30μm PI + 10μm FEP, 30μm PI + 10μm + 10μm FEP, 50μm PI + 10μm FEP, and 50μm PI + 10μm + 10μm FEP.

  Q3: Is the film available in single-sided and double-sided types?

  A: Yes. We offer both single-sided FEP coated PI film and double-sided FEP coated PI film for different lamination and insulation requirements.

  Q4: What are the main applications of this material?

  A: It is mainly used for copper foil lamination, flexible circuits, electronic insulation, and heat-resistant composite applications.

  Q5: Can you provide custom sizes?

  A: Yes. Custom width, roll length, and some special structures can be discussed based on your application requirements.

  Q6: Is this material suitable for high-frequency applications?

  A: Yes. The combination of PI and FEP makes it suitable for applications requiring insulation stability and low dielectric performance.