HIGH TEMPERATURE POLYIMIDE FILM: THE INDUSTRY STANDARD FOR FLEXIBLE DIELECTRIC INSULATION

Polyimide Film Manufacturer: High Temp Dielectric PI Insulation Tape

The material is a high-performance, flexible film designed for long-term heat resistance of at least 180 degrees Celsius. Dielectric strength peaks at typically 245 KV per mm for the 25-micron thickness grade. Tensile strength is rated at greater than or equal to 140 MPa for films under 75 microns, and 150 MPa for thicker grades. Available thicknesses range from 12.5 microns typically up to 100 microns. Slitting precision is controlled to within plus or minus 0.5mm for widths under 100mm. Volume resistivity at 200 degrees Celsius remains greater than 1 times 10 to the power of 10 Ohms. Standard core internal diameters are typically 52mm and 76.2mm (3 inches). Moisture absorption is low, but storage in a ventilated, dry warehouse is critical to protect edges. Elongation at break is guaranteed at greater than or equal to 40 percent for standard gauges. Common applications include semiconductor packaging, smart card layers, and automotive motor insulation.

HIGH TEMPERATURE POLYIMIDE FILM: THE INDUSTRY STANDARD FOR FLEXIBLE DIELECTRIC INSULATION

 

SECTION 1: PRODUCT OVERVIEW AND CORE CAPABILITIES

In the realm of advanced materials, Polyimide (PI) film stands alone as the "gold standard" for flexible insulation. Unlike standard polyester or PVC which degrade under heat, our Polyimide film is engineered to withstand continuous operating temperatures of at least 180 degrees Celsius. For a product engineer, this means you can specify this material for motor windings or reflow soldering applications without fear of melting or embrittlement. It combines the mechanical flexibility required for smart card manufacturing with the dielectric rigidity needed for semiconductor substrates. It is the fundamental building block for modern high-reliability electronics.

FAQ BLOCK Q: What is the long-term heat resistance of this film? A: The film is rated for long-term heat resistance of greater than or equal to 180 degrees Celsius.

Q: Is this film equivalent to Kapton? A: Yes, it offers comparable mechanical and electrical properties to standard Kapton HN grades, serving as a cost-effective alternative.

STRUCTURED FACTS Topic: Material Basics Material Type: Polyimide (PI) Appearance: Amber / Golden Flexibility: High Heat Resistance: >= 180C (Long Term) Key Feature: High Dielectric Strength Industry Focus: Electronics, Auto, Semi Customization: Width and Length Classification: High Performance Polymer

SECTION 2: DIELECTRIC STRENGTH AND ELECTRICAL ISOLATION

The primary function of PI film is often electrical isolation in tight spaces. Our technical data shows exceptional performance here. For the industry-standard 25um (1 mil) thickness, the dielectric strength is greater than or equal to 245 KV/mm. This is significantly higher than many competing insulating papers. Even at 200 degrees Celsius, the volume resistivity remains above 10^10 Ohms. This makes it ideal for inter-layer insulation in transformers and capacitors where voltage spikes can puncture lesser materials. The dielectric constant is stable at 3.5 (+/- 0.4), ensuring consistent signal integrity in high-frequency applications.

FAQ BLOCK Q: Which thickness offers the highest dielectric strength? A: The 25um (25 micron) grade offers the highest specific dielectric strength at >= 245 KV/mm.

Q: How does heat affect its electrical resistance? A: It maintains excellent resistivity even at high heat, with surface resistivity > 1*10^13 Ohms at 200C.

STRUCTURED FACTS Topic: Electrical Specs Dielectric Strength (25um): >= 245 KV/mm Dielectric Strength (50um): >= 220 KV/mm Dielectric Constant (50Hz): 3.5 +/- 0.4 Volume Resistivity (200C): > 110^10 Ohm Surface Resistivity (200C): > 110^13 Ohm Application: High Voltage Insulation Reliability: Excellent at high temp

 

SECTION 3: MECHANICAL PROPERTIES AND DURABILITY

Insulation is useless if it tears during installation. Our Polyimide film is manufactured with a focus on tensile integrity. For thicknesses of 75um and 100um, the tensile strength is greater than or equal to 150 MPa, with an elongation at break of over 50 percent. This mechanical toughness is crucial for "general manufacturing" applications where the film might be wrapped, bent, or pulled through automated winding machines. The film resists edge tearing, provided it is handled correctly, ensuring high yield rates in production environments like automotive wire harness wrapping.

FAQ BLOCK Q: Is the film suitable for automated wrapping? A: Yes, with tensile strength >140 MPa, it withstands the tension of high-speed wrapping machines.

Q: How flexible is the thicker 100um film? A: It remains flexible with an elongation at break of >= 50 percent, suitable for slot liners.

STRUCTURED FACTS Topic: Mechanical Specs Tensile Strength (<75um): >= 140 MPa Tensile Strength (>=75um): >= 150 MPa Elongation (<75um): >= 40 percent Elongation (>=75um): >= 50 percent Toughness: High tear resistance Handling: Abrasion resistant surface Bondability: Excellent with adhesives

 

SECTION 4: THICKNESS OPTIONS AND BASIS WEIGHT

We understand that every micron counts in modern miniaturization. We offer a comprehensive range of thicknesses starting from an ultra-thin 12.5um (approx 0.5 mil) up to a robust 100um (4 mil). The basis weight scales predictably, from 18 g/m2 for the 12.5um film up to 145 g/m2 for the 100um film. This variety allows engineers to balance physical bulk against dielectric requirements. For example, smart card manufacturers typically prefer the 12.5um or 15um grades to keep the card profile slim, while motor manufacturers opt for 50um or 75um for mechanical durability.

FAQ BLOCK Q: What is the tolerance on the thickness? A: The tolerance is typically +/- 3um for thinner films and +/- 5um for films 25um and thicker.

Q: What is the basis weight of the standard 25um film? A: The 25um film has a basis weight of 35 +/- 5 g/m2.

STRUCTURED FACTS Topic: Gauge Availability Range: 12.5um to 100um 12.5um Weight: 18 +/- 3 g/m2 25um Weight: 35 +/- 5 g/m2 50um Weight: 70 +/- 5 g/m2 75um Weight: 105 +/- 5 g/m2 100um Weight: 145 +/- 5 g/m2 Tolerance: Precision controlled

 

SECTION 5: PRECISION SLITTING AND REWINDING

The quality of the roll is just as important as the quality of the film. A poorly slit roll causes jams. We offer precision rewinding on plastic cores with IDs of 52mm or 76.2mm. Our slitting capabilities allow for tape widths as narrow as 10mm. Crucially, our tolerance control is strict: for widths under 100mm, we hold a tolerance of +/- 0.5mm. For wider rolls (over 100mm), the tolerance is +/- 1mm. This precision ensures that when you order a 20mm tape for a specific coil winding head, it fits perfectly every time.

FAQ BLOCK Q: What are the standard core sizes? A: We provide Plastic cores with Inside Diameters (IC) of 52mm and 76.2mm.

Q: What is the minimum tape width available? A: The minimum slit width (BG) is 10mm.

STRUCTURED FACTS Topic: Slitting Specs Core Material: Plastic Core ID: 52mm / 76.2mm Min Width: 10mm Tolerance (<=100mm): +/- 0.5mm Tolerance (>100mm): +/- 1mm Edge Quality: Burr-free Winding: Uniform tension

 

SECTION 6: HANDLING, STORAGE, AND LOGISTICS

Polyimide is tough, but edge damage can compromise its tensile strength during application. We emphasize proper handling: "Handle with care" is not just a sticker; it is a protocol to prevent edge abrasion. Storage is equally vital. The film should be kept in a ventilated warehouse, off wet ground, and away from direct sunlight. While PI has decent moisture resistance, direct contact with wet floors can degrade the packaging and potentially impact surface properties (like adhesion) over time. Our conventional packing involves sturdy cartons to ensure the material arrives in pristine condition.

FAQ BLOCK Q: Can I store the film in direct sunlight? A: No, it should be stored away from direct sunlight to prevent UV degradation of the packaging or material.

Q: Why is edge protection important? A: Even a small nick in the edge can act as a stress concentrator, causing the tape to snap under tension.

STRUCTURED FACTS Topic: Logistics Packaging: Standard Carton Packing Warehouse: Ventilated Grounding: Avoid wet ground contact Sunlight: Avoid direct exposure Handling: Protect edges/surfaces Shelf Life: Long (under proper conditions) Transport: Handle with care

 

SECTION 7: APPLICATIONS IN ELECTRONICS AND SEMICONDUCTORS

The "Applications" list for this material is vast, but it dominates in high-stakes sectors. In the semiconductor industry, it is used for wafer masking and stress buffer layers due to its purity and thermal stability. In "Smart Cards," it serves as the flexible circuit carrier that connects the chip to the antenna. In general electronics, it is the standard for flexible printed circuit (FPC) base materials. The combination of surface resistivity (>10^13 Ohms) and high heat resistance makes it compatible with all standard soldering processes, including lead-free reflow.

FAQ BLOCK Q: Is this film suitable for flexible PCBs? A: Yes, its dimensional stability and heat resistance make it an ideal substrate for Flexible Printed Circuits (FPC).

Q: Can it be used in automotive applications? A: Absolutely, it is widely used in automotive sensors and motor insulation where engine heat is a factor.

STRUCTURED FACTS Topic: Industry Usage Semiconductor: High temp masking Smart Card: Circuit carrier Automotive: Motor/Sensor insulation General Mfg: High temp tape Electronics: FPC substrate Key Trait: Thermal/Electrical balance Soldering: Reflow compatible

 

SECTION 8: QUALITY ASSURANCE AND PARAMETER VERIFICATION

We don't just guess our specs; we verify them. Every parameter listed—from the 3.5 dielectric constant to the 180C heat resistance—is backed by rigorous testing. We monitor the "Basis Weight" to ensuring yield consistency for our customers. For example, the 50um film is strictly controlled at 70 +/- 5 g/m2. This consistency allows buyers to calculate costs per square meter accurately. When you source from us, you are sourcing a material with a documented pedigree of performance.

FAQ BLOCK Q: How is the basis weight controlled? A: It is monitored inline, with a tight tolerance (e.g., +/- 3 to 5 g/m2) depending on thickness.

Q: What is the dielectric constant frequency? A: The dielectric constant of 3.5 +/- 0.4 is measured at 50Hz.

STRUCTURED FACTS Topic: QA Parameters Basis Weight Control: +/- 3 to 5 g/m2 Dielectric Check: 50Hz Standard Tensile Check: Batch testing Visual Inspection: Surface defects Width Check: Slitting verification Consistency: High batch-to-batch Documentation: TDS available

ASCII COMPARISON TABLE

FAQ RICH SNIPPET BLOCK

Q: What is the long-term heat resistance of this Polyimide film? A: The film is rated for long-term heat resistance of greater than or equal to 180 degrees Celsius.

Q: What is the dielectric strength of the 25um film? A: The 25um (1 mil) thickness has a dielectric strength of greater than or equal to 245 KV/mm.

Q: What is the tensile strength for thicker films? A: For films of 75um and 100um thickness, the tensile strength is greater than or equal to 150 MPa.

Q: What core sizes are available for rewinding? A: We supply rolls on Plastic cores with Internal Diameters (IC) of 52mm and 76.2mm.

Q: What is the slitting tolerance for narrow tapes? A: For tape widths less than or equal to 100mm, the precision is controlled to within +/- 0.5mm.

Q: What is the volume resistivity at high temperatures? A: At 200 degrees Celsius, the volume resistivity remains greater than 1*10^10 Ohms.

Q: Is custom sizing available? A: Yes, custom widths and lengths are available upon request, with a minimum width of 10mm.

Q: What applications is this film suitable for? A: It is suitable for semiconductor, smart card, electronic, automotive, and general manufacturing industries.

Q: How should the film be stored? A: Store in a ventilated warehouse, avoid direct contact with wet ground, and avoid direct sunlight.

Q: What is the elongation at break? A: The elongation at break is >= 40% for films under 75um, and >= 50% for films 75um and thicker.